When designing PCBs, you may be concerned about additional costs and the increasing number of layers. However, with HDI PCB technology, manufacturers can quickly reduce costs without reducing product quality. Technology not only helps you innovate new products but also enables you to develop future-proof products. So what exactly is an HDI PCB and why should you consider designing one? Read on and find out!
1、What is an HDI PCB?
In today’s face-paced industry, circuit board manufacturing. Conventional PCB routing methods cannot achieve this. With HDI, CAMTECH PCB offers companies and designers the opportunity to duplicate circuitry while reducing the area. The acronym ‘rigid PCB manufacturing. Here, the conditions apply to multilayer, single-sided, metalcore, HDI’ stands for High-Density Interconnect. These HDI Printed Circuit Boards or HDI PCBs are regular circuit boards that feature a higher density of wires across the entire surface area.
That results in a drastic reduction in the size and weight of the equipment. Not only that, but it improves the electrical performance of the equipment. In addition, it allows faster and more efficient data transmission due to the shortening of routes. You can easily tell them apart through the micro-vias, more delicate lines, thin materials, and higher pad density. These micro-vias can be blind or buried and up to about 0.006 in diameter. Therefore, it can be said that the HDI PCB has given birth to the miniaturization of products. Micro vias play an essential role in the design of these components. Find out about its importance below.
2, Micro vias and HDI PCBs
Before moving on to HDI PCB design, you should learn the role of micro vias on HDI PCBs. Micro vias are fine holes drilled by a laser that join two different layers electrically on a multilayer circuit board. Unlike vias, they are much smaller in size and thus directly related to the miniaturization and space-saving qualities of HDI PCBs. HDI designs include many different structures which we will get into in our next chapter.
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3, HDI structures
Typically, HDI PCBs can be designed in many ways. These are:
Unlike the green PCB, the contrast is lower. Any magnification is used to inspect the plate traces for defects. It should be noted that screen printing is known to sit well on the red background as it cleans up flux residue. Although red looks attractive, flashy, and bold, green is still considered the best.
4, HDR design rules and tips
In general, PCB layout is an intricate task. Combine that with micro vias and HDI circuitry, and you have a complicated mess. The complications are further intensified when it comes to aerospace systems and medical devices. As an engineer, you may be up for the challenge, but who says you have to do it without any help? Here are the best tips for designers and businesses:
Tip No. 1 – Adopt a DFM Strategy
Our first advice is quite simple and general. It is essential that they incorporate a DFM or Design manufacturing strategy with hdi PCB. If you end up designing something that is well beyond the capabilities of your contract manufacturer (CM), then the design could be useless.
Tip No. 2 – Choose the type of route
Choosing through type is a crucial decision that determines the machine and equipment you may need in the manufacturing process. It can greatly influence the costs involved in the process, as well as the time.
Micro vias themselves reduce manufacturing time and costs by reducing the number of layers and materials. However, you have to choose between the different types. These include the near-pad or via pad versions. Therefore, you should choose one that costs you or your CM less to manufacture without compromising the electrical performance of the HDI PCB.
Tip #3 – Check Component Availability and Size
Another point to consider is the number of components you expect to use for an HDI PCB. Remember that the number one goal of HDI PCBs is to reduce cost and surface area. You need to make sure they are small, inexpensive, and as few in number as possible.
Also, how you to position components can determine hole sizes, track widths, and backups. However, you should consider the availability and functionality of these components. Otherwise, you might end up redrawing the entire board.
Tip No. 4 – Do not saturate components
While the compact design may force your hand to fit components together, you should probably avoid it. High-power components, especially, can give rise to electromagnetic interference (EMI), which can affect signal quality. Also, nearby pad capacitances and inductances can affect the signal quality and delay transmission. Therefore, we recommend that you provide enough space between components. Also, make sure all components are positioned to distribute the vias symmetrically across the surface. It reduces stress, which in turn prevents any warping.